Qualcomm Technologies, Inc. and Alps Alpine Co., Ltd. today announced their expanded technology collaboration to integrate Qualcomm Technologies’ latest generation Snapdragon® Cockpit platform into Alps Alpine’s automotive products. This integration is intended to revolutionize future mobility solutions offered to automakers, equipping them with cutting-edge technology capabilities for, including generative artificial intelligence (GenAI), for intelligent and personalized in-cabin experiences. This announcement builds on the companies’ existing technology collaboration, which began in 2020 to develop Alps Alpine’s Digital Cabin technologies. These technologies aim to transform vehicle cockpits with sophisticated design and unparalleled comfort.
The Snapdragon Cockpit platform, a cornerstone of Qualcomm Technologies’ Snapdragon® Digital Chassis™ automotive portfolio, is engineered to revolutionize the in-vehicle experience with advanced computing and connectivity. Leveraging its computing prowess and integrated AI technology, this cutting-edge technology transforms automotive cockpits into ultra-responsive, intuitively interactive environments, enhancing driver and passenger engagement through premium infotainment, personalized convenience, and real-time connectivity.
Alps Alpine will incorporate the Snapdragon Cockpit platform to drive the next evolution of their High-Performance Reference Architecture (HPRA), which is used to perform software processing for the Digital Cabin. Initially powered by the previous generation of Snapdragon Cockpit Platform, the HPRA will now leverage the enhanced capabilities of the latest generation Snapdragon Cockpit platform to offer superior processing power for advanced human-machine interfaces (HMI), sensor integration, and connectivity solutions. This upgrade is aimed at providing enhanced safety, comfort, and entertainment standards within the vehicle. The Digital Cabin technologies from Alps Alpine, powered by Qualcomm Technologies, include an e-mirror providing a peripheral view with dramatically reduced blind spots, next-generation input and output devices integrated into door trims, a large ceiling display, and sound zones that project sound individually to each person.
“Integrating the latest generation Snapdragon Cockpit platform into our systems represents a major leap forward in our mission to deliver unparalleled in-vehicle experiences. This advanced platform empowers us to redefine automotive technology, offering everything from immersive entertainment to cutting-edge safety features,” said Yoshikatsu Watanabe, vice president, infotainment and sound business, Alps Alpine Co., Ltd.
“Our technology collaboration with Alps Alpine exemplifies our commitment to driving automotive innovation that enhances every aspect of the in-car experience. The Snapdragon Cockpit platform, with its integrated GenAI capabilities, is designed to meet the complex demands of modern vehicles, and we are excited to see how our work with Alps Alpine will leverage this technology to help set new industry standards,” said Mark Granger, vice president, product management, Qualcomm Technologies, Inc.
The expanded use of next-generation Snapdragon Cockpit platform by Alps Alpine is set to commence immediately, with integration processes already underway.
SOURCE: Qualcomm
