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Bosch designs Application-Specific Integrated Circuits for MEMS sensors in Dresden

Focus on automotive and consumer applications Design of Integrated Circuits for customer-specific demands Engagement in one of the most dynamic microelectronics centers in Europe Bosch has started its ASICs (Application-Specific Integrated Circuits) design activities for micro-electromechanical systems (MEMS) sensors in Dresden, Germany. These sensors are silicon-based and sense for instance motions, pressure or magnetic fields. … Continued

Focus on automotive and consumer applications

  • Design of Integrated Circuits for customer-specific demands
  • Engagement in one of the most dynamic microelectronics centers in Europe

Bosch has started its ASICs (Application-Specific Integrated Circuits) design activities for micro-electromechanical systems (MEMS) sensors in Dresden, Germany. These sensors are silicon-based and sense for instance motions, pressure or magnetic fields. MEMS sensors are to be used in a variety of automotive applications such as motor controls, vehicle dynamics controls and rollover detection – more and more in consumer electronics applications such as smart phones, games consoles or tablets as well.

The related ASIC reads out the sensor and transmits the metered value in analog or digital mode. The correspondent design of the circuit allows reliable and secure figures of merit to be required for applications such as in smart phones or cars.

Bosch sees a huge growth potential in the market for MEMS sensors and related ASICs (Application Specific ICs). The new Dresden design center expands the company’s existing network of IC design locations in Reutlingen, Munich, Shanghai and Bangalore. With its local presence in Dresden as one of Europe’s most dynamic microelectronics industrial centers, Bosch also gets access to the great academic and engineering potential in the Dresden area.

“Besides our profound expertise in MEMS technology, excellent IC developers are essential factors for the expansion of our innovative product portfolio,” says Udo-Martin Gomez , CTO of Bosch Sensortec GmbH. “At the same time, this move reflects Bosch’s commitment to Germany as semiconductor development and manufacturing location,” says Erich Biermann, Senior Vice President Engineering at Bosch Semiconductors.

Background:
MEMS technology Bosch was one of the pioneers in the development of micro-electromechanical systems (MEMS) technology, and the company has produced well over two billion MEMS sensors since the start of production in 1995. Production volumes reach new record levels every year, with around half a billion sensors leaving the Reutlingen plant in 2011. This makes Bosch the world market leader, with a product range that comprises pressure, acceleration, yaw-rate, and inertial sensors for many applications in the automotive industry and in consumer electronics. For more information about Bosch automotive sensors, visit www.bosch-sensors.com.

 

https://www.automotiveworld.com/news-releases/bosch-designs-application-specific-integrated-circuits-for-mems-sensors-in-dresden/

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