Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) adds another member to its family of intelligent power modules (IPMs): CIPOS™ Maxi IM818 series integrates various power and control components to increase reliability, optimize PCB size and system costs. The IPM is packaged in a DIP 36x23D housing. This makes it the smallest package for 1200 V IPMs with the highest power density and best performance in its class. CIPOS Maxi is especially suitable for low-power drives in applications such as motors, pumps, fans and active power factor correction for heating, ventilation and air conditioning.
The IM818 series provides an isolated dual-in-line molded housing for excellent thermal performance and electrical isolation. It meets EMI requirements and overload protection of demanding designs. Adding to the protection features, the IPM is equipped with an independent UL-certified temperature thermistor. CIPOS Maxi integrates a rugged 6-channel SOI gate driver to provide built-in dead time for preventing damages from transients. It features under-voltage lockout at all channels and over current shutdown. With its multi-function pin, this IPM allows for high design flexibility for various purposes. The low side emitter pins can be accessed for all phase current monitoring making the device easy to control.
SOURCE: Infineon
