Toyoda Gosei announces that it will soon begin sales of the glass-encapsulated ultraviolet LED products developed in March of last year for use as an industrial light source in the curing of resins, ink and adhesives.
These products maintain good reliability in high temperature, high humidity environments thanks to the complete encapsulation of the LED chip in glass, which minimizes the impact of gas penetration and moisture on the die. An improved crystal structure also raises the light output per LED die, while the use of flip-chip technology that directly connects the LED die to the substrate results in smaller product size. With these improvements, Toyoda Gosei glass-encapsulated UV-LEDs achieve light output per unit area of 200 mW/mm2, more than twice that of previous products.
These products will be displayed in the Toyoda Gosei booth at the Optics & Photonics International Exhibition, which will be held on April 19-21 at the Pacifico Yokohama Conference Center, Japan.
